What electronic components can you stamp?

We stamp EMI/RFI shields, connector pins, lead frames, battery contacts, heat sinks, PCB mounting brackets, and micro-precision terminals from copper, beryllium copper, phosphor bronze, and stainless steel.

What precision can you achieve for electronic stampings?

For electronic components, we achieve tolerances of +/-0.02mm with progressive dies. We can handle material thicknesses from 0.05mm to 2mm with high-speed stamping up to 300 SPM.

Electronics tëggin metal ci matris — High-estampage en métal de précision Kontakt yi ak cër yi

Àndaaleb tampoŋ bu jaar yoon mooy yax gi ci aparey ak sistem elektronik yu bees yi. Dañuy defar piyeesu tampoŋ yu am tolerans bu rëy ngir aparey elektronik yi, jokkoo tele, ordinatër, aparey elektronik oto, séddale doole, ak seytu usine - daale ko ci lëkkalekaay yu ndaw yiy natt fraksioŋ yu milimetre ba ci boîtier yu mag yiy muur EMI ak jumtukaayi jëfandikoo tàngoor.

Stampage elektronik dafay laaj tolerans bu gëna seere, macceer bu gëna sew, ak kalite bu gëna dëppoo ak bépp aplikaasioŋu stampage. Sunu ligne tëggin progressive yu gaaw yi, boole ci defarum matris bi ci biir kër gi ak jumtukaayi jumtukaay yu jaar yoon, daf nuy may nu mëna dëppoo ak yii ñuy laaj ci volume production yu tàmbalee ci ay junni wala ay milioŋ ciy pièce.

Komponent elektronik yi ñuy tampoon

Kontakt yi ak borne yi - PIN yu góor, prise yu jigéen, lëkkalekaay lam, borne fourche, borne bague ngir lëkkalekaay fiil-à-carte, plaque-à-plaque, ak lëkkalekaay fiil-à-fil
EMI/RFI — pot yuñ tampoñ, muur, kadre, ak stock baraam ngir aar ci jafe-jafe elektromagnetik ci sircuit yu xarañ yi
Eviers et diffuser thermiques - xeetu fin yuñ tampoon, pad thermique, ak jumtukaayi dindi tàngoor ngir elektronik yu am doole ak module LED
Kontakt batëri - lëkkalekaayu selil yu baax ak borne bu baax, ngir batëri
LED kadre plomb — cadre de plomb stampés de précision pour emballage LED avec pré-plaquation d'or ou d'argent
Kontakt yu ressort - interruptëri dome, coquilles pogo, clips à ressort, ak kontakt kompresioŋ ngir lëkkalekaay kuuraŋ
USB/connector shells - dëkkuwaay ak jumtukaayi kaaraange ngir USB, HDMI, RJ45, ak lëkkalekaay yuñ moomal

Kàttan yu leer ngir aparey elektronik

Kàttan	Specification
Dayo man-man bi gëna ndaw	0.010 pouces (0.25mm)
Muñ position	±0.0005 pouce (±0.013mm)
Material thickness	0.004 pouces ba 0.060 pouces
Gaawaayu estampage	Lu ëpp 1500 yoon ci simili bu nekk
Strip width	Ba 12 pouces
Plak	Pre-plated and post-plated (gold, silver, tin, nickel)

Materials for Electronics tëggin

Cuivre C110 (ETP) - yoonale bu gëna kawe, jëfandikoo ngir bar bus ak kontakt yu am courant bu bari
Cuivre C194 - conductivité bu baax ak doole bu gëna rëy, siiw ci kadre plomb
Cuivre C260 - ekilibre bu baax ci yoonale, forme, ak njëg ngir jokkool yu mag
Fosfor Bronze C510, C521 - Ressort bu baax ngir kontakt socket ak clips ressort
Beryllium Copper C172 - yoonale bu gëna kawe
Nikel xaalis C752 - tarnish resistant ngir kontakt yuñ mëna gis ak komposant commutateur
Acier inoxydable 304, 301 - ngir bouclier EMI, brackets structurel, ak ressort
Pre-plated materials - estañ, wurus, xaalis, ak nikel plate plaqué njëgu operations ñaareelu strip plaqué

Emballage pour composants électroniques

Danuy joxe emballage buñ jagleel montage otomatik:

Ruban ak bobine - ngir jël-ak-tegal SMT montage
Emballage tube - ngir pax mi ak lëkkalekaay yi
Bande porteuse (bobine à bobine) - pàcc yi des ci band porteuse ngir dugal otomatik
Tray packaging - ngir lëkkalekaay yu gëna mag yi soxla jubluwaay